The TSM A70 Series reflow oven includes Air and Nitrogen atmosphere reflow systems, offering 8, 9, 10 and 13-zone ovens to meet the needs of all manufacturers in the PCB assembly sector.
TSM Reflow Oven
TSM Reflow Oven
TSM was established in 1990 and began manufacturing SMT reflow ovens in 1999. They have developed a strong presence in the industry, with more than 1,000 ovens installed worldwide. TSM also manufactures wave solder machines, and introduced curing reflow ovens for semiconductors and LEDs in 2009, they notably also launched a twin, double-sided reflow oven in 2010.
Features & Benefits
Firstly, this oven has ultra-low power consumption, running at 10Kw under load. It comes as standard with a temperature monitoring function –the actual measured temperature is displayed on-screen, any Deviations are alerted by visual and audio alarms. It benefits from automatic conveyor adjustment, chain oiler and start-stop function. The entire system is controlled via the on-board PC, including heater temp, blower fan, and convection velocity. The profile setting is maintained within the optimum range by real time temp measuring in the oven. You can store a temperature profile memory for each product to reduce changeover times and eliminate separate profile checks.
|PCB Size||50mm – 460mm|
|Total Heating Length||2190mm|
|Individual Heating Zone Length||258mm|
|Heating Zones (Top)||8|
|Heating Zones (Bottom)||8|
|Temperature Accuracy||±1 °C|
|Power Supply||3 Phase|
|avg. Operating Power Consumption||10kw|