The SP700 becomes the SP710 when it is equipped with the optional Automatic Dispense unit (ADu).

With one micron solid state linear encoders, the SP710’s accuracy is astounding. The ADu can be fitted with any combination of paste and glue module, allowing you to cover all applications.


Speedprint SP710

The Speedprint SP710 SMT screen printer combines our commitment to high performance and reliability with outstanding value. The system has been designed to cope with the rigors of high volume SMT production, while incorporating the flexibility needed in high-mix, quick product set-up & change over environments.

Designed with ease of use & low cost of ownership in mind, the system utilises the most advanced drive control technology available, including 1 micron resolution Linear encoders on all axes, together with a suite of intuitive software that enables total control of the printing process.

Features of the SP700 Series

Unlike many alternative printers, the SP700 is fully equipped as standard, with many features.  These features include automatic rail width adjust, fully auto stencil loading and a fully programmable Under Stencil Cleaner.
The Under Stencil Cleaner is a highly efficient and fully programmable standard feature of the SP700 series. You can set this up to run wet or dry, in any combination.
Because SP700 features an advanced user interface running on the latest Windows-OS, SP700 series can provide comprehensive self diagnostic tools. For example production logging and auto fault report generation. As a result you are able to carry out “on the fly” trouble shooting.
We have utilised a unique twin roving camera ‘look down – look down’ method of auto vision alignment. This innovative vision system gives our Speedprint users the unique ability to check for solder paste on the stencil before printing starts. The vision system aligns the PCB with the stencil using fiducial marks and/or PCB/Stencil features.
Our Speedprint precision machined print head features closed loop squeegee control as standard, with fully programmable print parameters.
Adding to the flexibility of the SP700 platform is the standard capability to process ultra thin PCBs down to 0.2mm. This is achieved through installation of the UTC System which enables the substrate to be clamped top and bottom with equalised pressure and independently of the drive belts, thus producing zero distortion of the substrate and maintaining optimum process control.

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